Veille NAE : Fiabilité 20190401

Chaque semaine NAE vous propose une veille technologique sur une thématique de sa feuille de route technologique.

Aujourd’hui retrouvez sa veille sur la thématique Fiabilité qui abordera :

  • Littelfuse – SiC Schottky diodes ideal for enhancing efficiency, reliability and thermal management – Electropages
    Source : www.electropages.com – 2019-03-25
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  • What Are the Benefits of Silicon Carbide in Semiconductors? – EuroScientist
    Source : www.euroscientist.com – 2019-03-25
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  • 650V SiC Schottky diodes in new package sizes reach 40A
    Source : www.eenewspower.com – 2019-03-22
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  • Heat-resistant packaging technology for wide bandgap power devices and thermal reliability testing
    Source : ieeexplore.ieee.org – 2019-03-20
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  • Development of SiC Chip Based Power Package for High Power and High Performance Application
    Source : ieeexplore.ieee.org – 2019-03-20
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  • A nearly-perfect Ag joints prepared by novel Ag to Ag direct bonding
    Source : ieeexplore.ieee.org – 2019-03-20
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  • TI isolated gate drivers integrated sensing for IGBTs and SiC MOSFETs
    Source : www.electronicsweekly.com – 2019-03-18
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  • Compact SiC MOSFETs for automotive, energy, data center applications
    Source : www.eenewsautomotive.com – 2019-03-18
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  • DC/DC transformers for gate drivers provide isolation up to 1200V
    Source : www.smart2zero.com – 2019-03-07
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